DARPA, division of advanced military projects of the United States, today announced that they are considering how to implement a modular design to chips that will use their robots, drones or more advanced equipment to take advantage of the possibilities of exchange of functions offered by this type of designs.
Basically what you are looking at the U.S. Agency is to quickly transform a commodity into one much more complex with just add desired modules. An example of this idea can observe it carefully in products are already on the market in intelligent relog format or in others, in this case, smartphones, as they can be the LG G5, Moto Z and Google’s Project Ara is even expected.
DARPA modular chips reach the domestic market.
For this DARPA engineers are working on a project where you try to design a new architecture where to mix and combine the work of small chip where each, in turn, perform a certain function. Thanks to this, according to the Agency, will be save effort both in design and cost while increasing possibilities in terms of functionality from a single plate.
In this way, with just add or remove chips to a plate, is can program robots, drones, or any type of system in general without having to change all their internal architecture or processor. We found one very interesting point that, contrary to everything what tends to make DARPA, at this time this technology not only will be used in military projects or national security, but that also reach the population getting this way, ending the complex battle of patents that little by little we are accustomed to see between large multinational.
More information: DARPA
