Sunday , April 14 2024
Home / News / LeEco will be the first smartphone with Qualcomm Snapdragon 823

LeEco will be the first smartphone with Qualcomm Snapdragon 823

LeEco

Month to month LeEco signature is making a dent in the world of mobile phones, quedandole little to reach or be on the same level as Apple or Samsung. Recently we have known thanks to a Chinese website LeEco will soon present a smartphone with new Qualcomm Snapdragon 823 processor.

This is a new Qualcomm processor for high-end mobiles, a processor, which outperforms the 820 Snapdragon processor which has terminals like the Samsung Galaxy S7 (a special version), Xiaomi Mi5 or the 950 Lumia.

LeEco could have the most powerful smartphone thanks Snapdragon 823 and 8 Gb of ram

The new smartphone LeEco will be presented in a MWC in Shanghai, an event which will take place on June 29 and where will this device, which if it complies with the rumors, might be much higher to terminals as the S7 Samsung Galaxy or iPhone 6S. And it is that this new terminal of LeEco will also 8 Gb of RAM, a 530 Adreno GPU and a photo sensor of 25 MP. On the battery and the screen we know nothing but I doubt that it is not in sync with the rest of the hardware. But these are only rumours, so far only know that the new Snapdragon 823 will be presented onstage.

Although LeEco is the first manufacturer that uses this processor, the truth is that even users are reluctant with the new processors of Qualcomm for slumps that occurred with the Snapdragon 810, a processor that had an error and is sobrecalentaba. This error appears that it has been forgotten by the company with the Snapdragon 820, but you can always have a comeback and have another error. In any case we have little time to check the performance and power of this new processor do not you think?

Check Also

The Facebook Messenger light option becomes 132 countries more

A good while ago that almost compulsory application of Facebook messaging is thickening with features …

Leave a Reply

Your email address will not be published. Required fields are marked *