A long time ago since Microsoft develase us project Hololens and full capacity. In that time the company American had to well talk about practically all them components used to give form to Hololens except them features of its mysterious processor graphic or, as it have baptized in Redmond, HPU (Holographic Processing Unit).
This week is going on the annual Conference Hot Chips, event chosen by Microsoft to reveal, finally, all the secrets of the HPU chip, broadly speaking, a 24-core processor of 28 nm designed by specialists of TSMC. This processor is responsible for all the calculations needed to make experience much faster, namely 200 times faster as you would a 14-nm Intel processor.
Microsoft reveals all the features internal of the mysterious chip HPU of Hololens.
I implementing a little more in detail, we specifically have a processor developed by TSMC 28-nanometer technology, this has allowed in its interior there are 65 millions of logic gates, 8 MB SDRAM, additional 1 GB of DDR3 RAM, PCIe and even standard serial interfaces. The consumption approved is so only in 10W.
In addition to all it earlier, the chip team nothing less that 24 processors digital of signals signed by Tensilica, these processors are the responsible of the processing digital of them signals external. For get accelerate all the process of creation of the reality augmented, is have added 10 instructions completely custom what, according to the source of the news, the HPU present in Hololens should be able of perform a trillion of calculations by second.
As already discussed during his presentation, we cannot forget the existence of a processor Intel Atom x 5-Z8100 64 bit 1.04 GHz based in Airmont 14nm technology architecture, 2 GB of RAM and 64 GB of internal storage which are free 54 GB so that the user can store anything you want. With regard to the battery, talk of a module of 16.5 Wh.
More information: The Register
