In the last press release launched by Western Digital is confirmed as the manufacturer of hard drives caba start the production of the third generation of 3D NAND chips flash. As a reminder, let know you that this technology significantly improves power consumption, increases reliability, improves the write speed and reduces the cost per gygabyte. This new generation, in addition, passing, chip density will increase as stated by the title of 48 to 64 layers allowing double the storage capacity.
These new chips of 64 layers of Western Digital have started manufacturing at the factory that the company has in the city of Yokkaichi, Japan. This new version, dubbed BiCS3 is expected to finally reach the market between the fourth quarter of this year and the first half of 2017.
Yokkaichi factory is chosen for the manufacture of Western Digital 3D NAND chips
As detail, let know you that this release has been possible thanks to the joint development carried out for months by both Western Digital and Toshiba engineers. Once reach the market this technology, initially, it will distribute close to 32 GB capacities. In subsequent months the density will grow reaching the market, whose capacity will be halfterabyte drives.
As reviewed Siva Sivaram, Executive Vice President of Western Digital:
The launch of the next generation of 3D NAND technology based on the architecture of 64 layers reinforces our leadership in a technology NAND flash. BiCS3 will have the 3 bits per cell, developed technology to deliver increased capacity, performance and reliability to an interesting cost. We know how to go from 24 to 36 layers, from 48 to 64 layers layers and so on in what today are working on chips of 100 layers.
More information: pcworld
